Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2
Rigid PCB cushion pad is specially designed for hot lamination buffering during rigid printed circuit board manufacturing. This red rigid cushion press pad effectively replaces hot press kraft paper, significantly improving dimensional safety and stability in rigid PCB production. It features outstanding lamination performance and high stability, greatly enhancing yield and efficiency in the PCB production process.
Product Features
- Reusable for 300-500 lamination cycles, significantly reducing PCB production costs
- Superior performance in flatness, wear resistance, size increase ratio, and thickness variation compared to hot press kraft paper
- Excellent high temperature resistance, operating continuously at up to 280℃ without carbonization or brittleness
- Outstanding buffering effect and thermal conductivity with stable compression increase and expansion coefficient
- Good tear resistance with flame retardant, non-toxic, odorless, dust-free, and shavings-free properties
- Excellent breathability for optimal performance
Product Structure
Rigid PCB cushion pads are available in two configurations based on their positioning in the lamination stack. Top and bottom cushion pads are positioned at the extremities of the PCB lamination sheet package, while middle layer cushion pads are used between PCB layers. Middle layer pads typically measure 1.5-2.0mm thick, while top and bottom pads range from 4.0mm to 6.5mm in thickness.
These cushion pads (also known as press pads, cushion mats, buffering pads, or hot press cushions) are ideal for physical buffering operations in middle layers and manual operations requiring multiple sheet replacements. They are equally suitable for automated PCB laminating operations, replacing multiple sheets of hot press kraft paper with a single pad, reducing production material costs by at least 20%.
Layer Composition
- Nano high temperature resistant coating
- Fiberglass cloth
- High molecular weight polymer
- Tensile tear layer
- Polymer aggregates
- Fiberglass cloth
- Nano high temperature resistant coating
Technical Parameters
| Parameter |
Specification |
| Service Life |
300-500 cycles |
| High Temperature Resistance |
≤280℃ |
| Thickness (Top/Bottom Pad) |
4mm-6.5mm |
| Thickness (Middle Layer Pad) |
1.5-2.0mm |
| Thickness Tolerance |
±0.3mm |
| Standard Sizes (L*W) |
1500*1300mm, 1300*780mm, 1170*690mm, 1160*665mm, 1180*660mm, 1295*788mm, 27.5"*24", 45"*51", 59"*51" |
| Size Tolerance |
±2mm |
| Tensile Strength |
≥ 25 MPa |
| Buffer Standard |
≥ 12% |
| Water Absorption Standard |
< 8% (3-8%) |
Applications
Also known as PCB lamination cushion press pad, PCB cushion mat, PCB buffering pad, or PCB hot press pad, this product serves as essential cushioning and buffering material for completing the PCB printed circuit board lamination process. It is a critical component in ensuring high-quality PCB manufacturing with improved efficiency and reduced material costs.
